基于agent的半导体晶圆厂动态调度

Li Li, F. Qiao, Qidi Wu
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引用次数: 5

摘要

半导体晶圆厂被认为是第三种生产系统,区分为作业车间和流程车间。它有自己的调度和控制特点,如重新进入,大规模,混合加工模式和不平衡的生产设施。为了解决半导体晶圆厂的调度问题,提出了一种基于智能体的半导体晶圆厂调度方法。首先,提出了一种集放行控制、调度和机器维修调度于一体的基于智能体的调度模型。其次,给出了代理间的协商协议——扩展契约网协议(ECNP)。第三,给出了智能体决策的调度算法。最后,以半导体晶圆制造的一个简单模型为例,说明了该方法的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Agent-based dynamic scheduling for semiconductor wafer fab
Semiconductor wafer fab is considered as the third kind of production system, differentiated with job shop and flow shop. It has its own scheduling and control characteristics, such as re-entrance, large-scale, mix processing model and unbalanced production facilities. To solve scheduling problem of semiconductor wafer fab, an agent-based scheduling approach for semiconductor wafer fab is proposed. Firstly, an agent-based scheduling model, which integrates release control, dispatching and machine maintenance scheduling, is presented. Secondly, negotiation protocol between agents, extended contract net protocol (ECNP), is given. Thirdly, scheduling algorithms for decision making of agents are offered. Finally, a simple model, but with essential characters of semiconductor wafer fabrication, is used to demonstrate how to use the proposed agent-based scheduling approach.
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