7nm节点三叉finfet应力增强性能分析

J. Jena, Tara Prasanna Dash, S. Das, E. Mohapatra, C. K. Maiti
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引用次数: 0

摘要

在22nm技术节点下,短通道效应成为一个严重的问题。这可以通过多栅极器件如双栅极(DG)、三栅极(TG)来克服。三门FinFET结构在数字和模拟应用中都显示出巨大的潜力。在这项工作中,我们在7nm技术节点上模拟了一个真实的PMOS体硅FinFET,其中epi-SiGe作为源/漏(S/D)应力源。应变增强机制已应用于SiGe S/D应力源上的菱形桥梁。利用应力历史模型和弹性理论计算了外延S/D应力源在沟道中的应力。与没有应力的器件相比,通道中的“导通电流”提高了30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Stress Enhanced Performance Analysis for Trigate FinFETs at 7nm Node
Short channel effect becomes a serious concern below 22nm technology node. This can be overcome by multigate devices such as double gate (DG), trigate (TG). Trigate FinFET structures have shown great potential for both digital and analog applications. In this work, we have simulated a realistic PMOS bulk-Si FinFET with epi-SiGe as a source/drain (S/D) stressor at a 7nm technology node. The strain enhancement mechanisms have been used in the diamond-shaped bridges patterned on SiGe S/D stressor. The stress in the channel due to epitaxial S/D stressor has been calculated using the stress history model and the theory of elasticity. A 30% improvement of the ‘on current’ in the channel as compared to the device without stress is demonstrated.
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