{"title":"通孔模型中通孔瞬变电磁法模式假设的研究","authors":"Yaojiang Zhang, Shenhui Jing, J. Fan","doi":"10.1109/APEMC.2012.6237873","DOIUrl":null,"url":null,"abstract":"The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. The results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver.","PeriodicalId":300639,"journal":{"name":"2012 Asia-Pacific Symposium on Electromagnetic Compatibility","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Studies of TEM mode assumption on via holes in via modelings\",\"authors\":\"Yaojiang Zhang, Shenhui Jing, J. Fan\",\"doi\":\"10.1109/APEMC.2012.6237873\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. The results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver.\",\"PeriodicalId\":300639,\"journal\":{\"name\":\"2012 Asia-Pacific Symposium on Electromagnetic Compatibility\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 Asia-Pacific Symposium on Electromagnetic Compatibility\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEMC.2012.6237873\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Asia-Pacific Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEMC.2012.6237873","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Studies of TEM mode assumption on via holes in via modelings
The assumption of transverse electromagnetic (TEM) field distribution on via holes is checked by a two-dimensional (2D) finite difference method (FDM). It is found that for a via without pad, TEM mode assumption is a quite good approximation. However, for a via with a pad, i.e. the via pad radius is different from the via barrel radius, the field distribution on the via hole begins to deviate from the TEM mode. This indicates previous analytical formula for a via with pad may need to be modified at very high frequencies due to its usage of TEM field assumption on via holes. The results obtained by 2D FDM have been verified by a three-dimensional commercial electrostatic solver.
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