应变层器件在图像化衬底上的外延

W. Schaff, K. Hur, L. Eastman, R. Compton, P. Mandeville
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引用次数: 1

摘要

研究了伪晶MODFET结构在图像化衬底上的生长,作为增加应变层临界层厚度的一种手段。在生长之前,使用化学辅助离子束蚀刻对半绝缘的砷化镓衬底进行图案和蚀刻,以确定一系列台面。然后通过分子束外延在衬底上生长双掺杂伪晶MODFET层。为了在非平面晶圆上制备modfet,开发了一种新的制备技术
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Strained layer device epitaxy on patterned substrates [MODFETs]
The growth of pseudomorphic MODFET structures on a patterned substrate was investigated as a means of increasing the critical layer thickness of strained layers. Prior to growth, semi-insulating GaAs substrates were patterned and etched using chemically assisted ion beam etching to define a series of mesas. Double-doped pseudomorphic MODFET layers were then grown on the substrates by molecular beam epitaxy. To fabricate MODFETs on the resulting non-planar wafer, a new fabrication technique has been developed.<>
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