高压锅条件下Cu-EMC界面的断裂韧性

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765860

M. Sadeghinia, K. Jansen, L. Ernst, G. Schlottig, H. Pape

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引用次数: 3

摘要

接口分层是微电子工业失效的根本原因之一，因此受到越来越多的关注。为了能够判断界面断裂的危险性，需要获得界面的临界断裂性能，即界面断裂韧性。界面断裂韧性高度依赖于温度、湿度和模态混合。这项工作涉及在高压锅条件下(bbb100°C和100% RH)测量EMC-Cu引线框架界面的断裂韧性。为了处理它，需要一个高压室，即高压锅或压力容器。在压力室中安装了混合型弯曲装置。这将使双材料试样在组合模式I/II条件下具有规定的开口位移成为可能

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Fracture toughness of Cu-EMC interfaces under pressure cooker conditions

Delamination of interfaces is known as one of the root causes of failure in microelectronic industry and therefore is getting more and more attention. In order to be able for judging the risk of the interface fracture, the critical fracture properties of the interfaces should be available i.e. Interfacial fracture toughness. Interfacial fracture toughness is highly dependent to temperature, moisture and mode mixity. This work deals with the fracture toughness measurements of an EMC-Cu lead frame interface under pressure cooker conditions ( >100 °C & 100% RH). To deal with it, a chamber with high pressure, i.e. pressure cooker or pressure vessel, is needed. A mixed mode bending setup is installed in the pressure chamber. This will make it possible to have a prescribed opening displacement under combined mode I/II conditions on a bi-material specimen

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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