耦合超材料微带线的数值研究

H. Wei, Xiaofei Xu, Kaya Pi
{"title":"耦合超材料微带线的数值研究","authors":"H. Wei, Xiaofei Xu, Kaya Pi","doi":"10.1109/iWEM52897.2022.9993486","DOIUrl":null,"url":null,"abstract":"The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.","PeriodicalId":433151,"journal":{"name":"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical Study of the Coupled Metamaterial Microstrip Lines\",\"authors\":\"H. Wei, Xiaofei Xu, Kaya Pi\",\"doi\":\"10.1109/iWEM52897.2022.9993486\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.\",\"PeriodicalId\":433151,\"journal\":{\"name\":\"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iWEM52897.2022.9993486\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iWEM52897.2022.9993486","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文对耦合超材料微带线的特性进行了数值研究。新的耦合元msl的一个特殊特性是,它们可以在走线之间的距离非常短的情况下工作,这使得它们可以在高密度布局封装中使用,而紧凑的尺寸是非常重要的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical Study of the Coupled Metamaterial Microstrip Lines
The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信