{"title":"耦合超材料微带线的数值研究","authors":"H. Wei, Xiaofei Xu, Kaya Pi","doi":"10.1109/iWEM52897.2022.9993486","DOIUrl":null,"url":null,"abstract":"The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.","PeriodicalId":433151,"journal":{"name":"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Numerical Study of the Coupled Metamaterial Microstrip Lines\",\"authors\":\"H. Wei, Xiaofei Xu, Kaya Pi\",\"doi\":\"10.1109/iWEM52897.2022.9993486\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.\",\"PeriodicalId\":433151,\"journal\":{\"name\":\"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)\",\"volume\":\"24 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iWEM52897.2022.9993486\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iWEM52897.2022.9993486","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Numerical Study of the Coupled Metamaterial Microstrip Lines
The characteristics of coupled metamaterial microstrip lines (meta-MSLs) are numerically studied in this work. A particular feature for the new coupled meta-MSLs is that they can work with a very short distance between the traces, making them proposing to be utilized in a high-density layout package where the compact sizes are of much concern.