用于振动惯性传感器的高q硅弯曲谐振器:极限阻尼机制的研究

B. Le Foulgoc, O. Le Traon, S. Masson, A. Parent, T. Bourouina, F. Marty, A. Bosseboeuf, F. Parrain, H. Mathias, J.-P. Grilles
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引用次数: 4

摘要

在设计微尺度振动传感器时,实现在弯曲模式下工作的高质量因数(Q)谐振器仍然是一个主要问题。本研究着重探讨了单晶硅弯曲光束谐振器的Q限制及其对大范围谐振器几何形状、温度和压力的依赖性。为了使谐振元件不受支承阻尼的影响,采用有限元分析方法对系统进行了优化,并实现了高解耦效率。质量因子作为频率的函数表明,随着谐振器的小型化,热弹性阻尼(TED)和表面阻尼作为限制机制之间的转变:在高真空条件下,热弹性理论被实验验证为Q的主要阻尼源,最高可达4.0 × 104。在这些值之外(Q > 1.4 × 105),表面效应表现为厚度和频率变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-Q silicon flexural resonators for vibrating inertial sensors: Investigations of the limiting damping mechanisms
In designing micro-scale vibrating sensors, the achievement of very high quality factor (Q) resonators working in bending mode remains a major issue. Special attention has been paid in this work to explore the Q limitations of single-crystal silicon bending beam resonators and their dependences on geometry, temperatures and pressure for a large range of resonators. In order to preserve the resonating element from support damping, a system with high decoupling efficiency has been optimized using FEM analyses and implemented. Quality factor as a function of frequency shows the transition between thermoelastic damping (TED) and surface damping as limiting mechanism with the miniaturization of the resonators: At high vacuum, the thermoelastic theory is experimentally validated to be the main damping source for Q up to 4.0x104. Beyond these values (Q > 1.4x105) the surface effects are evidenced and characterized with thickness and frequency variations.
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