金属-层间-半导体源/漏极结构的7nm n型锗无结场效应晶体管性能评价

Seung-Geun Jung, Hyun‐Yong Yu
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引用次数: 0

摘要

在本研究中,利用Sentaurus三维技术计算机辅助设计(TCAD)演示了金属-层间-半导体源/漏(MIS S/D)结构对7nm n型锗(Ge)无结场效应管(JLFET)增强模式的影响。采用MS S/D结构的器件由于严重的费米水平钉钉(FLP)而无法正常工作在关断模式下,采用MIS S/D结构可以缓解FLP。我们比较了正常关闭的JLFET模型的性能,包括MIS S/D,传统金属半导体S/D (MS S/D)和非钉住金属半导体S/D (un钉住MS S/D)结构。MIS S/D结构的导通电流为6.09 × 10−4 A/um,接触电阻率为3 × 10−9Ω-cm2。我们还对不同掺杂浓度的MIS S/D JLFET进行了分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance evaluation of 7nm n-type germanium junctionless field-effect-transistor with metal-interlayer-semiconductor source/drain structure
In this study, the impact of Metal-Interlayer-Semiconductor Source/Drain (MIS S/D) structure on enhancement mode 7nm n-type germanium (Ge) junctionless FET (JLFET) is demonstrated with Sentaurus 3-D technology computer-aided design (TCAD). The device using MS S/D structure cannot operate for normally-off mode because of severe Fermi-level pinning (FLP) and using MIS S/D structure can be a solution by alleviating the FLP. We compared performances of the normally-off JLFET models which include MIS S/D, conventional metal-semiconductor S/D (MS S/D) and unpinned metal-semiconductor S/D (unpinned MS S/D) structures. The MIS S/D structure provides on-state current of 6.09 × 10−4 A/um and contact resistivity of 3 × 10−9Ω-cm2. We also analyzed the MIS S/D JLFET by different doping concentrations.
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