SRAM与锁存复用器设计风格和时钟门控选择的功率和热效应

Yingmin Li, Mark Hempstead, Patrick Mauro, D. Brooks, Zhigang Hu, K. Skadron
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引用次数: 12

摘要

本文研究了队列结构和阵列结构中设计风格和时钟门控风格对能效和热性能的影响。这些结构是功耗的主要来源,并且在现代高性能处理器中可以找到设计风格和各种时钟门控方案。虽然电路领域的一些工作已经从功率的角度探索了这些问题,但热处理不太常见,而且我们还没有意识到在架构领域有任何工作。我们研究了SRAM和锁存器和多路复用器(“锁存复用器”)设计及其相关的时钟门控选项。使用两种设计风格的电路级模拟,我们得出功耗比,然后用于周期级功率/性能/热模拟。我们发现,尽管SRAM设计的“无约束”功率总是优于锁存复用设计,但当结构的平均占用率低而访问率高时,锁存复用设计在实践中消耗的功率更少,特别是当使用“失速门控”来最小化开关功率时。我们还发现,从热的角度来看,具有失速门控的锁存复用器设计特别有前途,因为它们比SRAM设计具有更低的功率密度。总的来说,当与sram的实现和验证挑战相结合时,具有失速门控的锁存复用器设计在具有热约束的设计中显得特别有前途。本文还展示了在进行早期设计探索时考虑架构和电路设计选择之间相互作用的重要性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power and thermal effects of SRAM vs. latch-mux design styles and clock gating choices
This paper studies the impact on energy efficiency and thermal behavior of design style and clock-gating style in queue and array structures. These structures are major sources of power dissipation, and both design styles and various clock gating schemes can be found in modern, high-performance processors. Although some work in the circuits domain has explored these issues from a power perspective, thermal treatments are less common, and we are not aware of any work in the architecture domain. We study both SRAM and latch and multiplexer ("latch-mux") designs and their associated clock-gating options. Using circuit-level simulations of both design styles, we derive power-dissipation ratios which are then used in cycle-level power/performance/thermal simulations. We find that even though the "unconstrained" power of SRAM designs is always better than latch-mux designs, latch-mux designs dissipate less power in practice when a structure's average occupancy is low but access rate is high, especially when "stall gating" is used to minimize switching power. We also find that latch-mux designs with stall gating are especially promising from a thermal perspective, because they exhibit lower power density than SRAM designs. Overall, when combined with implementation and verification challenges for SRAMs, latch-mux designs with stall gating appear especially promising for designs with thermal constraints. This paper also shows the importance of considering the interaction between architectural and circuit design choices when performing early-stage design exploration.
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