空间辐射环境下聚酰亚胺薄膜力学性能演变的比较

Zicai Shen, Xiao Li, Shijie Liu
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引用次数: 1

摘要

聚酰亚胺薄膜广泛应用于航天器,但其力学性能在电子、质子、近紫外或远紫外等空间环境中会出现退化。利用北京空间环境工程研究所(BISSE) Φ800联合空间辐射试验装置研究了聚酰亚胺薄膜在电子、质子、近紫外和远紫外下的力学性能和机理,并利用电子拉伸试验机测试了聚酰亚胺薄膜的力学性能退化情况。PI薄膜的拉伸强度和断裂伸长率随电子和质子辐照强度的增加而减小,随近紫外和远紫外辐照强度的增加,PI薄膜的拉伸强度和断裂伸长率先减小后增大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of mechanical properties evolution of polyimide films in space radiation environment
Polyimide films are widely used in spacecraft, but their mechanical properties would degrade in space environments, such as electron, proton, near ultraviolet or far ultraviolet, etc. The mechanical property and mechanism of polyimide film in electron, proton, near ultraviolet and far ultraviolet was studied by Φ800 combined space radiation test facility of Beijing Institute of Space Environment Engineering (BISSE), and the degradation of mechanical property of polyimide film was tested by Electronic tensile testing machine. The tensile strength and the rupture elongation of PI film decrease with the increase of electron and proton radiation, while tensile strength and the rupture elongation of PI film decrease firstly and then increase with near ultraviolet and far ultraviolet.
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