中红外激光器中As/Sb混合层的调制分子束生长

C. Mourad, K. Malloy
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摘要

采用分子束外延的方法在InGaAs/InGaSb三元合金中生长出短周期超晶格,目的是近似于InGaAsSb四元合金。这种利用三元成分构建短周期超晶格取代季系半导体合金的技术被称为“数字合金化”。生长了3组2微米In0.1Ga0.9AsySb1-y块体合金;第一组是在不同的生长温度下常规生长的,而另外两组是数字化生长的。第一组与GaSb相匹配的数字合金晶格在不同的衬底温度下生长,第二组在一个恒定的生长温度下生长,但具有不同的超晶格周期。采用高分辨率x射线衍射和室温光致发光技术,研究了大块In0.1Ga0.9AsySb1-y合金的结构和光学性能。结果表明,数字合金对生长温度变化的敏感性约为3倍,在弛豫开始前可以生长的最大周期约为9 ML。研究了使用数字合金技术生长的具有InGaAsSb量子阱和AlGaAsSb势垒的约2微米光泵浦激光结构。室温工作、104 W/cm2的低阈值电流密度(80k, 808 nm泵浦)和104 K的高特征温度(TO)表明数字合金化技术应用于中红外光学器件的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modulated molecular beam growth of mixed As/Sb layers for mid-infrared lasers
Short period superlattices of the ternary InGaAs/InGaSb alloys are grown by molecular beam epitaxy with the intent of approximating a quaternary InGaAsSb alloy. This technique where a quaternary semiconductor alloy is replaced by building short period superlattices using its ternary constituents is referred to as 'digital alloying.' Three sets of 2 micrometer In0.1Ga0.9AsySb1-y bulk alloys are grown; the first set was grown conventionally with varying growth temperature, while the other two sets were grown digitally. The first set of digital alloys lattice matched to GaSb is grown at various substrate temperatures, the second set was grown at one constant growth temperature but with various superlattice periodicities. Using high-resolution x-ray diffraction and room temperature photoluminescence, the structural and optical properties of the bulk In0.1Ga0.9AsySb1-y alloys were investigated. It is observed that the digital alloys are less sensitive to changes in the growth temperature by a factor of approximately 3, and the maximum periodicity a digital alloy can be grown before the onset of relaxation is approximately 9 ML. An optically pumped approximately 2 micrometer laser structure with InGaAsSb quantum wells and AlGaAsSb barriers both grown using the digital alloy technique was characterized. Room temperature operation, a low threshold current density of 104 W/cm2 (at 80 K with 808 nm pump), and a high characteristic temperature (TO) of 104 K show the feasibility of applying digital alloying techniques to mid-infrared optical devices.
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