相控晶闸管短路影响的大规模三维TCAD研究

M. Bellini, J. Vobecký
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引用次数: 4

摘要

计算机硬件和求解算法的不断进步使纳米级和功率半导体器件的3D TCAD模拟得到了更广泛的应用。然而,BiMOS功率半导体器件(如igbt)需要相对较小的3D模拟结构(fa 10×10×1000/im3数量级),而双极功率器件(如晶闸管)则需要更大的fa 10 mm3数量级的模拟结构。这项工作提出了相控晶闸管的大规模3D模拟,并描述了用于减少计算时间的技术,以达到与工业实践兼容的程度。三维TCAD用于了解阴极短路对击穿电压和dV/dt等指标的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Large-scale 3D TCAD study of the impact of shorts in phase controlled thyristors
Continuous advances in computer hardware and solving algorithm enable more pervasive use of 3D TCAD simulations for both nanoscale and power semiconductor devices. However, while BiMOS power semiconductor devices such as IGBTs require relatively small 3D simulated structures (of the order of fa 10×10×1000/im3), bipolar power devices such as thyristors require much larger simulated structures of the order of fa 10 mm3. This work presents large scale 3D simulations of Phase Controlled Thyristors and describes the technique used to reduce computation times to extents compatible with industrial practice. 3D TCAD is used to understand the impact of cathode shorts on figures of merit such as the breakdown voltage and dV/dt.
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