高频、低成本，功率封装采用薄膜功率叠加技术

Proceedings of 1995 IEEE Applied Power Electronics Conference and Exposition - APEC'95 Pub Date : 1995-03-05 DOI:10.1109/APEC.1995.468955

R. Fisher, R. Fillion, J. Burgess, W. Hennessy

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引用次数: 81

摘要

采用创新的嵌入式芯片MCM技术实现了高功率电路的性能改进。该电源封装的开发基于薄膜MCM工艺的扩展，该工艺取代了混合电源电路的寄生限制线键和具有低阻抗多层金属互连的封装限制SMT电源电路。本文介绍了薄膜功率覆盖技术，以及这种封装结构如何提高电学、热学和可靠性性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High frequency, low cost, power packaging using thin film power overlay technology

The improved performance of high power circuits are achieved using an innovative embedded chip MCM technology for power applications. This power package development is based upon an extension of a thin film MCM process which replaces the parasitic limiting wirebonds of hybrid power circuits and the package limiting SMT power circuits with low impedance, multilayer metal interconnects. This paper describes the thin film power overlay technology and how this package structure improves electrical, thermal, and reliability performance.<>

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来源期刊

Proceedings of 1995 IEEE Applied Power Electronics Conference and Exposition - APEC'95

CiteScore

3.20

自引率

0.00%

发文量