二苯二甲酸二酐和4,4′-二氨基-3,3′-二甲基二苯甲烷制备薄膜

CAS 2010 Proceedings (International Semiconductor Conference) Pub Date : 2010-12-03 DOI:10.1109/SMICND.2010.5650719

I. Sava, S. Chisca, M. Brumǎ, G. Lisa, C. Buiculescu

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引用次数: 0

摘要

在不同温度下，对苯二酚四羧基二酐和4,4′-二氨基-3,3′-二甲基二苯基甲烷基聚酰亚胺薄膜进行热处理，得到了不同亚酰化程度的聚酰亚胺结构。通过动态力学分析、接触角和介电光谱测量，研究了薄膜的热特性和介电特性。

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Thin films based on benzophenontetracarboxylic dianhydride and 4,4'-diamino-3,3'-dimethyldiphenylmethane

The thermal treatment of polyamidic acid films based on benzophenontetracarboxylic dianhydride and 4,4'-diamino-3,3'-dimethyl diphenylmethane, at different temperatures, led to polyimide structures having different degree of imidization. The thermal and dielectric characteristics of the films were investigated by using dynamic mechanical analysis, contact angles and dielectric spectroscopy measurements.

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CAS 2010 Proceedings (International Semiconductor Conference)

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