反应离子蚀刻:微光学元件的通用制造技术

M. Ferstl
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引用次数: 1

摘要

反应离子蚀刻(RIE)是半导体工业中一项成熟的技术,也被证明是制造光学元件的通用工具。利用基于氟的工艺,我们在石英玻璃和硅中制造折射球形和圆柱形微透镜以及各种衍射光学元件(DOEs),例如菲涅耳区透镜(FZLs),线性二元光栅,三角形光栅等。此外,我们还实现了波导元件,首先是用于波分复用应用的硅基硅阵列波导光栅(awg)。为了满足这些不同光学结构的具体要求(形状、特征尺寸、分辨率、蚀刻深度等各不相同),必须选择合适的结构方法、掩模材料和蚀刻参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reactive ion etching: a versatile fabrication technique for micro-optical elements
Reactive ion etching (RIE), a well established technology in semiconductor industries, has proven to be also a versatile tool for the fabrication of optical components. Using fluor based processes, we fabricated refractive spherical and cylindrical microlenses as well as various diffractive optical elements (DOEs) e.g. Fresnel zone lenses (FZLs), linear binary gratings, triangular gratings etc., in quartz glass and in silicon. Furthermore we realized waveguide components, above all arrayed waveguide gratings (AWGs) in silica on silicon for WDM applications. To meet the specific demands of these various optical structures (differing in shape, feature size, resolution, etch depth, etc.) appropriate structuring methods, mask materials and etching parameters had to be chosen.
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