{"title":"基于多层石墨烯纳米带的互连性能分析","authors":"M. Kaur, N. Gupta, A. Singh","doi":"10.1109/IMARC.2017.8449677","DOIUrl":null,"url":null,"abstract":"Multilayer Graphene nanoribbon (MLGNR) are emerging as prominent future material for chip interconnects owing to their simple fabrication process and equivalent performance to CNTs. This paper presents performance analysis of MLGNR based interconnects on equivalent single-conductor (ESC) model for local/intermediate and global level of chip interconnects at 13.4 and 21 nm technology nodes. The number of conducting channel variations with Fermi energy and interconnect width are analyzed first. The performance of metallic armchair (AC) and Zig-Zag (ZZ) based MLGNR interconnects is computed employing equivalent single conductor (ESC) model in terms of delay, average power consumption, and power-delay product (PDP). The computed results for metallic armchair and Zig-Zag MLGNR are compared against Copper based interconnects. It is observed that MLGNRs offer significantly improved delay ratio, average power reduction, and lower PDP values than copper based interconnects.","PeriodicalId":259227,"journal":{"name":"2017 IEEE MTT-S International Microwave and RF Conference (IMaRC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Performance Analysis of Multilayer Graphene Nanoribbon Based Interconnects\",\"authors\":\"M. Kaur, N. Gupta, A. Singh\",\"doi\":\"10.1109/IMARC.2017.8449677\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Multilayer Graphene nanoribbon (MLGNR) are emerging as prominent future material for chip interconnects owing to their simple fabrication process and equivalent performance to CNTs. This paper presents performance analysis of MLGNR based interconnects on equivalent single-conductor (ESC) model for local/intermediate and global level of chip interconnects at 13.4 and 21 nm technology nodes. The number of conducting channel variations with Fermi energy and interconnect width are analyzed first. The performance of metallic armchair (AC) and Zig-Zag (ZZ) based MLGNR interconnects is computed employing equivalent single conductor (ESC) model in terms of delay, average power consumption, and power-delay product (PDP). The computed results for metallic armchair and Zig-Zag MLGNR are compared against Copper based interconnects. It is observed that MLGNRs offer significantly improved delay ratio, average power reduction, and lower PDP values than copper based interconnects.\",\"PeriodicalId\":259227,\"journal\":{\"name\":\"2017 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMARC.2017.8449677\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE MTT-S International Microwave and RF Conference (IMaRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMARC.2017.8449677","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance Analysis of Multilayer Graphene Nanoribbon Based Interconnects
Multilayer Graphene nanoribbon (MLGNR) are emerging as prominent future material for chip interconnects owing to their simple fabrication process and equivalent performance to CNTs. This paper presents performance analysis of MLGNR based interconnects on equivalent single-conductor (ESC) model for local/intermediate and global level of chip interconnects at 13.4 and 21 nm technology nodes. The number of conducting channel variations with Fermi energy and interconnect width are analyzed first. The performance of metallic armchair (AC) and Zig-Zag (ZZ) based MLGNR interconnects is computed employing equivalent single conductor (ESC) model in terms of delay, average power consumption, and power-delay product (PDP). The computed results for metallic armchair and Zig-Zag MLGNR are compared against Copper based interconnects. It is observed that MLGNRs offer significantly improved delay ratio, average power reduction, and lower PDP values than copper based interconnects.