{"title":"混合信号便携式无线封装设计与测试挑战","authors":"M. Swaminathan, S. Pannala","doi":"10.1109/IWV.1998.667124","DOIUrl":null,"url":null,"abstract":"Operation of wireless communication systems with mixed signal circuits operating in gigahertz range frequencies has raised the need for new test and design methodologies to meet the current and future market requirements. This paper discusses the challenges arising in mixed signal portable wireless packaging with emphasis on design and test. Solutions being pursued at PRC are also discussed.","PeriodicalId":185325,"journal":{"name":"Proceedings IEEE Computer Society Workshop on VLSI'98 System Level Design (Cat. No.98EX158)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Mixed signal portable wireless packaging design and test challenges\",\"authors\":\"M. Swaminathan, S. Pannala\",\"doi\":\"10.1109/IWV.1998.667124\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Operation of wireless communication systems with mixed signal circuits operating in gigahertz range frequencies has raised the need for new test and design methodologies to meet the current and future market requirements. This paper discusses the challenges arising in mixed signal portable wireless packaging with emphasis on design and test. Solutions being pursued at PRC are also discussed.\",\"PeriodicalId\":185325,\"journal\":{\"name\":\"Proceedings IEEE Computer Society Workshop on VLSI'98 System Level Design (Cat. No.98EX158)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings IEEE Computer Society Workshop on VLSI'98 System Level Design (Cat. No.98EX158)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWV.1998.667124\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Computer Society Workshop on VLSI'98 System Level Design (Cat. No.98EX158)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWV.1998.667124","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mixed signal portable wireless packaging design and test challenges
Operation of wireless communication systems with mixed signal circuits operating in gigahertz range frequencies has raised the need for new test and design methodologies to meet the current and future market requirements. This paper discusses the challenges arising in mixed signal portable wireless packaging with emphasis on design and test. Solutions being pursued at PRC are also discussed.