耗尽模式器件的低温阈值行为表征与仿真

F. Gaensslen, R. Jaeger, J.J. Walker
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引用次数: 20

摘要

耗尽型和增强型MOS器件的阈值电压特性在室温和液氮温度之间的变化是根本不同的。如其他地方(I)所述,增强模式阈值电压不受载流子冻结的影响;它仅显示了由于温度相关参数变化以及基本不变的衬底灵敏度而导致的幅度增加。然而,耗尽模式器件的实际测量显示出明显不同的温度依赖性。随着温度的降低,通常通过n通道技术中的浅层供体植入实现的负阈值电压偏移会随着衬底灵敏度的降低而降低。这两种变化都可以用补偿的n型浅层内的冻结来解释。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low temperature threshold behavior of depletion mode devices—Characterization and simulation
INTRODUCTION The changes in threshold voltage characteristics observed between room and liquid nitrogen temperature for depletion and enhancement mode MOS devices are fundamentally different. As described elsewhere (I), the enhancement mode threshold voltage is not affected by carrier freezeout; it shows only an increase in magnitude due to temperature dependent parameter changes combined with an essentially unaltered substrate sensitivity. Actual measurements of depletion mode devices, however, show a significantly different temperature dependency. With decreasing temperature, the negative threshold voltage shift, usually achieved by a shallow donor implantation within an n-channel technology, is reduced as is the substrate sensitivity. Both changes can be accounted for by freezeout within the shallow, compensated, n-type surface layer.
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