Harm Dillen, G. Rebel, Jennifer Massier, Dominika Grodzinka, R. Bruls
{"title":"用于降低原位掩模污染源的材料分析技术","authors":"Harm Dillen, G. Rebel, Jennifer Massier, Dominika Grodzinka, R. Bruls","doi":"10.1117/12.2220400","DOIUrl":null,"url":null,"abstract":"Using SEM-EDS analysis on small (< 200 nm) particles is challenging, especially on a substrate with multiple background elements present. We will show a methodology combining three techniques to get the most information out of small particles. This method combines low energy EDS with a nontraditional approach to improve statistics in EDS and elemental mapping. This methodology is required for ASML’s EUV platform, the NXE scanner to continue system improvement for a system showing already low defect count. The poor particle statistics on particle defects lead to a limited amount of particles available for diagnostics, which implies that all information on particle characteristics should be used for diagnostics.","PeriodicalId":193904,"journal":{"name":"SPIE Advanced Lithography","volume":"9778 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Material analysis techniques used to drive down in-situ mask contamination sources\",\"authors\":\"Harm Dillen, G. Rebel, Jennifer Massier, Dominika Grodzinka, R. Bruls\",\"doi\":\"10.1117/12.2220400\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Using SEM-EDS analysis on small (< 200 nm) particles is challenging, especially on a substrate with multiple background elements present. We will show a methodology combining three techniques to get the most information out of small particles. This method combines low energy EDS with a nontraditional approach to improve statistics in EDS and elemental mapping. This methodology is required for ASML’s EUV platform, the NXE scanner to continue system improvement for a system showing already low defect count. The poor particle statistics on particle defects lead to a limited amount of particles available for diagnostics, which implies that all information on particle characteristics should be used for diagnostics.\",\"PeriodicalId\":193904,\"journal\":{\"name\":\"SPIE Advanced Lithography\",\"volume\":\"9778 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Advanced Lithography\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2220400\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Advanced Lithography","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2220400","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Material analysis techniques used to drive down in-situ mask contamination sources
Using SEM-EDS analysis on small (< 200 nm) particles is challenging, especially on a substrate with multiple background elements present. We will show a methodology combining three techniques to get the most information out of small particles. This method combines low energy EDS with a nontraditional approach to improve statistics in EDS and elemental mapping. This methodology is required for ASML’s EUV platform, the NXE scanner to continue system improvement for a system showing already low defect count. The poor particle statistics on particle defects lead to a limited amount of particles available for diagnostics, which implies that all information on particle characteristics should be used for diagnostics.