集成电路引线框架封装材料选择方法的比较

Proceedings of the Fifteenth National Radio Science Conference. NRSC '98 (Cat. No.98EX109) Pub Date : 1998-02-24 DOI:10.1109/NRSC.1998.711516

W. Boulos, H. Ragaie, S. Sakr, N. El-Mahallawy

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引用次数: 0

摘要

本文对集成电路引线框封装的选材方法进行了比较研究。图的选择方法已经被发现是一个合适的解决方案，以找到最近的材料满足材料的性质约束。

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Comparison of material selection methods for lead-frame package encapsulation of integrated circuits

This paper proposes a comparative study of material selection methods as applied to lead-frame package encapsulation of integrated circuits. The chart selection method has been found to be a suitable solution to find the nearest material fulfilling the property constraints on materials.

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Proceedings of the Fifteenth National Radio Science Conference. NRSC '98 (Cat. No.98EX109)

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