{"title":"表面安装设备软焊触点的疲劳","authors":"H. Hieber","doi":"10.1109/RELPHY.1988.23456","DOIUrl":null,"url":null,"abstract":"An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<<ETX>>","PeriodicalId":102187,"journal":{"name":"26th Annual Proceedings Reliability Physics Symposium 1988","volume":"112 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fatigue of soft-soldered contacts at surface-mounted devices\",\"authors\":\"H. Hieber\",\"doi\":\"10.1109/RELPHY.1988.23456\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<<ETX>>\",\"PeriodicalId\":102187,\"journal\":{\"name\":\"26th Annual Proceedings Reliability Physics Symposium 1988\",\"volume\":\"112 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"26th Annual Proceedings Reliability Physics Symposium 1988\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1988.23456\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"26th Annual Proceedings Reliability Physics Symposium 1988","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1988.23456","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fatigue of soft-soldered contacts at surface-mounted devices
An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<>