表面安装设备软焊触点的疲劳

H. Hieber
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引用次数: 0

摘要

对软焊触点的部分可逆流动力学进行了研究。指出不可逆应变的局部化给热疲劳试验的失效预测带来了困难。讨论了SnPb/sub - 40/焊料的粘弹性流动,以及软焊触点的微观结构
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fatigue of soft-soldered contacts at surface-mounted devices
An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb/sub 40/ solder is discussed, along with the microstructure of soft-soldered contacts.<>
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