“无铅焊接”的发展方向及解决方案

{"title":"“无铅焊接”的发展方向及解决方案","authors":"K. Suganuma","doi":"10.2320/MATERIA.38.919","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":328460,"journal":{"name":"Bulletin of the Japan Institute of Metals","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-12-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"\\\"Lead-Free Soldering\\\", Its Direction and Soluition\",\"authors\":\"K. Suganuma\",\"doi\":\"10.2320/MATERIA.38.919\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":328460,\"journal\":{\"name\":\"Bulletin of the Japan Institute of Metals\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-12-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Bulletin of the Japan Institute of Metals\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2320/MATERIA.38.919\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Bulletin of the Japan Institute of Metals","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2320/MATERIA.38.919","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}