旋涂法固溶制In-Si-O薄膜晶体管的研究

Ha-My Hoang, T. Hori, T. Yasuda, Takio Kizu, K. Tsukagoshi, T. Nabatame, B. Trinh, A. Fujiwara
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引用次数: 3

摘要

在这项工作中,我们探索了用溶液法制备3 at的最佳条件。%掺硅氧化铟薄膜晶体管(TFTs)。采用x射线反射率(XRR)和x射线衍射(XRD)技术对In-Si-O (ISO)薄膜进行了研究,并采用传统的三探针方法对tft的操作进行了表征。XRR结果表明,随着退火温度的升高,薄膜厚度减小。此外,根据XRD测量,无论薄膜厚度如何,ISO薄膜在850℃开始结晶。最佳的ISO TFT值为VT -5 V,µof1.32 cm2/Vs, SS为1 V/dec,通断电流比约为107。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation on solution-processed In-Si-O thin-film transistor via spin-coating method
In this work, we have explored optimum fabrication condition by a solution processing method for 3 at.% Si-doped indium oxide thin-film transistors (TFTs). In-Si-O (ISO) thin films were investigated by X-ray reflectivity (XRR) and X-ray diffraction (XRD) techniques, and the operation of TFTs was characterized by a conventional three-probe method. XRR results suggested that as the annealing temperature increased, the film thickness decreased. In addition, according to XRD measurement, the ISO film started crystalline from 850°C regardless the film thickness. The best ISO TFT showed the value of VT of-5 V, µ of1.32 cm2/Vs, SS of1 V/dec, and on/off current ratio about 107.
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