{"title":"使用线路统一HEMT模块和多层微带线的小型化、超宽带Mmic平衡上转换器","authors":"T. Takenaka, H. Ogawa","doi":"10.1109/APMC.1992.672047","DOIUrl":null,"url":null,"abstract":"This paper describes an MMIC balanced upconverter employing a novel line unifhd HEMT module and multilayer microstrip lines. The advantages of the up-converter are ultrawideband pexformance and a reduction in chip size which results from the combination of the line unSed HEMT module with multilayer microstrip lines. A 3-31GHz balanced upconverter performance is realized in only 1.7mmXO.9mmMMICcbipsize.","PeriodicalId":234490,"journal":{"name":"AMPC Asia-Pacific Microwave Conference,","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-08-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Miniaturized, Ultra-Wideband Mmic Balanced Up-Converter using a Line Unified HEMT Module and Multilayer Microstrip Lines\",\"authors\":\"T. Takenaka, H. Ogawa\",\"doi\":\"10.1109/APMC.1992.672047\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes an MMIC balanced upconverter employing a novel line unifhd HEMT module and multilayer microstrip lines. The advantages of the up-converter are ultrawideband pexformance and a reduction in chip size which results from the combination of the line unSed HEMT module with multilayer microstrip lines. A 3-31GHz balanced upconverter performance is realized in only 1.7mmXO.9mmMMICcbipsize.\",\"PeriodicalId\":234490,\"journal\":{\"name\":\"AMPC Asia-Pacific Microwave Conference,\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-08-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"AMPC Asia-Pacific Microwave Conference,\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APMC.1992.672047\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"AMPC Asia-Pacific Microwave Conference,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APMC.1992.672047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Miniaturized, Ultra-Wideband Mmic Balanced Up-Converter using a Line Unified HEMT Module and Multilayer Microstrip Lines
This paper describes an MMIC balanced upconverter employing a novel line unifhd HEMT module and multilayer microstrip lines. The advantages of the up-converter are ultrawideband pexformance and a reduction in chip size which results from the combination of the line unSed HEMT module with multilayer microstrip lines. A 3-31GHz balanced upconverter performance is realized in only 1.7mmXO.9mmMMICcbipsize.