实验设计集成电路制造中的离线质量控制

M. Phadke, R. N. Kackar, D. Speeney, M. Grieco
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引用次数: 166

摘要

本文介绍了离线质量控制方法及其在3.5 μm互补金属氧化物半导体电路中接触窗形成工艺优化中的应用。离线质量控制方法是优化生产过程和产品设计的系统方法。它在日本被广泛使用,以低成本生产高质量的产品。离线质量控制的关键步骤是:(i)确定可操纵的重要过程因素及其潜在的工作水平;(ii)使用正交阵列设计对该工艺进行分数因子实验;(iii)分析结果数据,以确定各因素的最佳运行水平(分析中同时考虑过程均值和过程方差;(iv)进行额外的实验,以验证新的因子水平确实改善了质量控制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Off-line quality control in integrated circuit fabrication using experimental design
In this paper we describe the off-line quality control method and its application in optimizing the process for forming contact windows in 3.5-μm complementary metal-oxide semiconductor circuits. The offline quality control method is a systematic method of optimizing production processes and product designs. It is widely used in Japan to produce high-quality products at low cost. The key steps of off-line quality control are: (i) Identify important process factors that can be manipulated and their potential working levels; (ii) perform fractional factorial experiments on the process using orthogonal array designs; (iii) analyze the resulting data to determine the optimum operating levels of the factors (both the process mean and the process variance are considered in this analysis; (iv) conduct an additional experiment to verify that the new factor levels indeed improve the quality control.
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