热载流子老化及其在使用偏差下的变化:动力学、预测、对Vdd和SRAM的影响

M. Duan, J. F. Zhang, A. Manut, Z. Ji, W. Zhang, A. Asenov, L. Gerrer, D. Reid, H. Razaidi, D. Vigar, V. Chandra, R. Aitken, B. Kaczer, G. Groeseneken
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引用次数: 17

摘要

随着CMOS规模的缩小,热载流子老化(HCA)规模扩大,可能再次成为一个极限老化过程。这促使人们重新审视HCA,但最近的研究主要集中在通过提高压力偏差来加速HCA,而关于使用偏差下的HCA的信息很少。早期的研究提出高偏倚和低偏倚下的HCA机制不同,质疑高偏倚数据是否可以用于预测使用偏倚下的HCA。这项工作的一个关键进展是提出了一种新的方法来评估使用偏差下hca诱导的变化。首次通过实验验证了在使用偏差下预测HCA的能力。证明了从HCA中分离RTN的重要性。指出商用SMU (Source-Measure-Unit)测量的HCA给出了错误的功率指数。所提出的方法最大限度地减少了测试次数,模型只需要3个拟合参数,使其易于实现。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hot carrier aging and its variation under use-bias: Kinetics, prediction, impact on Vdd and SRAM
As CMOS scales down, hot carrier aging (HCA) scales up and can be a limiting aging process again. This has motivated re-visiting HCA, but recent works have focused on accelerated HCA by raising stress biases and there is little information on HCA under use-biases. Early works proposed that HCA mechanism under high and low biases are different, questioning if the high-bias data can be used for predicting HCA under use-bias. A key advance of this work is proposing a new methodology for evaluating the HCA-induced variation under use-bias. For the first time, the capability of predicting HCA under use-bias is experimentally verified. The importance of separating RTN from HCA is demonstrated. We point out the HCA measured by the commercial Source-Measure-Unit (SMU) gives erroneous power exponent. The proposed methodology minimizes the number of tests and the model requires only 3 fitting parameters, making it readily implementable.
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