一种垂直场极板耦合浮岛和两外延层的4H-SiC沟槽MOSFET

W. Wang, D. Hu, Xintian Zhou, Yunpeng Jia, Yu Wu
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引用次数: 0

摘要

提出了一种新型的具有垂直场极板耦合浮岛结构的碳化硅u型沟槽MOSFET(UMOSET)。采用双外延层。利用Sentaurus TCAD进行了仿真研究。研究了场板和浮岛对电场分布、击穿电压和比导通电阻(sRON, sp)的影响,并分别讨论了第一漂移区和第二漂移区掺杂浓度与击穿电压的关系。仿真结果表明,垂直场极板耦合浮岛结构的VFF-UMOSFET击穿电压和导通电阻的优值比现有的源沟槽(ST-MOSFET)分别提高了37.5%和65%,沟槽栅极底部电场峰值比标准UMOSFET降低了60%;同时有效地减小了场板底部的电场。最后讨论了场板深度、浮岛几何形状等参数的优化问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 4H-SiC Trench MOSFET with the vertical field plate coupled floating island and two epi-layers
A novel silicon carbide (SiC) U-shape trench MOSFET(UMOSET) with the vertical field plate coupled floating island structure (VFF-UMOSFET) is proposed. Double epitaxial layer is adopted. Simulations study is performed using Sentaurus TCAD. The effect of the field plate and floating island on the electric field distribution, breakdown voltage and specific ON-resistance (sRON, sp) are studies and the relationship between doping concentration and breakdown voltage in the first drift zone and the second drift zone is discussed respectively. The simulation results show that the VFF-UMOSFET with the vertical field plate coupled floating island structure exhibits a higher figure of merit related to the breakdown voltage and the specific on-resistance, which is improved by 37.5% and 65%, respectively, with comparison to the state-of-the-art source trench(ST-MOSFET) and reduce the peak of the electric field at the trench-gate bottom by 60%, compared with the standard UMOSFET, while effectively reducing the electric field at the field plate bottom. Finally, the optimization of parameters (field plate depth, floating island geometry) is discussed.
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