{"title":"轻掺杂混合信号集成电路中衬底耦合噪声的三维混合建模","authors":"Yongsheng Wang, Fang Li, Hualing Yang, Yonglai Zhang, Yanhui Ren","doi":"10.1109/ASICON.2013.6811905","DOIUrl":null,"url":null,"abstract":"Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.","PeriodicalId":150654,"journal":{"name":"2013 IEEE 10th International Conference on ASIC","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs\",\"authors\":\"Yongsheng Wang, Fang Li, Hualing Yang, Yonglai Zhang, Yanhui Ren\",\"doi\":\"10.1109/ASICON.2013.6811905\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.\",\"PeriodicalId\":150654,\"journal\":{\"name\":\"2013 IEEE 10th International Conference on ASIC\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE 10th International Conference on ASIC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASICON.2013.6811905\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 10th International Conference on ASIC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASICON.2013.6811905","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D hybrid modeling of substrate coupling noise in lightly doped mixed-signal ICs
Because of the widely used of mixed-signal SoC, substrate coupling noise has become an important problem. A reasonable substrate model is necessary for estimating the impact of substrate noise. Compared with previous work, the proposed 3D hybrid model includes 3D RC substrate network for the aggressor and victim and macro model for the noise coupling path. Developed model of commonly used for isolating noise such as guard ring is also proposed. The efficiency of different regions of guard ring and single and double guard ring are compared and analyzed to draw a general conclusion.
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