使用薄膜悬臂梁的直流接触RF MEMS开关

Hui Shen, S. Gong, N. S. Barker
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引用次数: 11

摘要

本文介绍了采用薄膜悬臂梁实现的直流触点RF-MEMS SPST、SP3T和SP4T开关的发展。在制造过程中,采用铝作为牺牲层,在50~70 V的测量驱动电压下实现了平面悬臂梁。SPST开关被用作构建块来实现更复杂的SP3T和SP4T开关,用于实时延迟移相器。SP3T和SP4T开关的初步测量表明,在50 GHz范围内,隔离度为20 dB,插入损耗小于2 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC-Contact RF MEMS Switches using Thin-Film Cantilevers
This paper describes the development of DC-contact RF-MEMS SPST, SP3T, and SP4T switches implemented with a thin-film cantilever. Using aluminium as the sacrificial layer in the fabrication process, flat cantilevers are realized with a measured actuation voltage of 50~70 V. The SPST switch is used as a building block to realize more complicated SP3T and SP4T switches for use in true-time delay phase shifters. The preliminary measurements of the SP3T and SP4T switches demonstrate isolation of 20 dB and insertion loss less than 2 dB up to 50 GHz.
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