高级合成与物理设计的并行跨层优化

James Williamson, Yinghai Lu, L. Shang, H. Zhou, Xuan Zeng
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引用次数: 2

摘要

集成电路(IC)设计自动化传统上遵循分层方法。现代IC设计流程分为顺序寻址设计层和优化层;每一个都在设计细节和数据粒度上不断细化,同时增加了计算复杂性。设计层之间的最终一致标志着设计的结束。获得设计闭合是一个持续存在的问题,因为缺乏意识和层之间的交互通常会导致多个设计流迭代。在这项工作中,我们提出了平行的跨层优化,其中设计层之间的边界被打破,允许对设计空间进行更明智和有效的探索。我们利用当前和即将到来的多核/多核计算平台的异构并行计算能力来适应多个设计层的异构特性。具体来说,我们统一了高层和物理合成设计层,以实现并行跨层集成电路设计优化。此外,我们还引入了一个具有局部和全局收敛测试的大规模并行GPU floorplanner作为提议的物理合成设计层。我们的结果显示,与最先进的技术相比,平均性能提高了11倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Parallel cross-layer optimization of high-level synthesis and physical design
Integrated circuit (IC) design automation has traditionally followed a hierarchical approach. Modern IC design flow is divided into sequentially-addressed design and optimization layers; each successively finer in design detail and data granularity while increasing in computational complexity. Eventual agreement across the design layers signals design closure. Obtaining design closure is a continual problem, as lack of awareness and interaction between layers often results in multiple design flow iterations. In this work, we propose parallel cross-layer optimization, in which the boundaries between design layers are broken, allowing for a more informed and efficient exploration of the design space. We leverage the heterogeneous parallel computational power in current and upcoming multi-core/many-core computation platforms to suite the heterogeneous characteristics of multiple design layers. Specifically, we unify the highlevel and physical synthesis design layers for parallel cross-layer IC design optimization. In addition, we introduce a massively-parallel GPU floorplanner with local and global convergence test as the proposed physical synthesis design layer. Our results show average performance gains of 11X speed-up over state-of-the-art.
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