一种高性能干燥方法，可实现集束式单晶圆湿式清洗

2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) Pub Date : 2000-06-13 DOI:10.1109/VLSIT.2000.852768

P. Mertens, G. Doumen, J. Lauerhaas, K. Kenis, W. Fyen, M. Meuris, S. Arnauts, K. Devriendt, R. Vos, M. Heyns

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引用次数: 3

摘要

提出了一种用于单晶片湿式清洗的快速干燥方法。无水印干燥方法是基于马兰戈尼力和旋转力之间的有效相互作用。该方法具有优异的颗粒性能。

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A high performance drying method enabling clustered single wafer wet cleaning

A novel fast drying method for single wafer wet cleaning is proposed. The water-mark free drying method is based on an efficient interaction between Marangoni forces and rotational forces. The method is shown to yield excellent particle performance.

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来源期刊

2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104)

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