uniMorph:用于改变形状界面的薄膜复合材料

Felix Heibeck, B. Tome, Clark Della Silva, H. Ishii
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引用次数: 61

摘要

研究人员一直在研究改变形状的界面,然而,制造薄的、可逆的形状改变的技术仍然很复杂。uniMorph是一种快速数字化制造定制薄膜变形界面的使能技术。通过结合铜的热电特性和超高分子量聚乙烯的高热膨胀率,我们能够直接驱动柔性电路复合材料的形状。通过温度驱动机制实现形状变化驱动,降低了薄形状变化界面的制造复杂性。本文介绍了如何设计和制备单晶硅薄复合材料。我们提出的复合材料是由环境温度变化或主动加热嵌入式结构驱动的,并提供了形状变化原语的系统概述。最后,我们提出了不同的传感技术,利用现有的铜结构或可以无缝嵌入到uniMorph复合材料。为了证明uniMorph的广泛适用性,我们介绍了在无处不在和移动计算中的几个应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
uniMorph: Fabricating Thin Film Composites for Shape-Changing Interfaces
Researchers have been investigating shape-changing interfaces, however technologies for thin, reversible shape change remain complicated to fabricate. uniMorph is an enabling technology for rapid digital fabrication of customized thin-film shape-changing interfaces. By combining the thermoelectric characteristics of copper with the high thermal expansion rate of ultra-high molecular weight polyethylene, we are able to actuate the shape of flexible circuit composites directly. The shape-changing actuation is enabled by a temperature driven mechanism and reduces the complexity of fabrication for thin shape-changing interfaces. In this paper we describe how to design and fabricate thin uniMorph composites. We present composites that are actuated by either environmental temperature changes or active heating of embedded structures and provide a systematic overview of shape-changing primitives. Finally, we present different sensing techniques that leverage the existing copper structures or can be seamlessly embedded into the uniMorph composite. To demonstrate the wide applicability of uniMorph, we present several applications in ubiquitous and mobile computing.
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