用于通信、传感和成像的混合硅光子和电子解决方案

A. Hajimiri
{"title":"用于通信、传感和成像的混合硅光子和电子解决方案","authors":"A. Hajimiri","doi":"10.1109/GROUP4.2015.7305902","DOIUrl":null,"url":null,"abstract":"Silicon photonics offer large bandwidths and low-loss delay, while integrated electronics can provide gain and complex signal processing with much lower overhead. Here, we will discuss a few examples of such hybrid solutions to demonstrate the potential of a more holistic approach to silicon integrated systems.","PeriodicalId":244331,"journal":{"name":"2015 IEEE 12th International Conference on Group IV Photonics (GFP)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Hybrid silicon photonics and electronics solutions for communications, sensing, and imaging\",\"authors\":\"A. Hajimiri\",\"doi\":\"10.1109/GROUP4.2015.7305902\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Silicon photonics offer large bandwidths and low-loss delay, while integrated electronics can provide gain and complex signal processing with much lower overhead. Here, we will discuss a few examples of such hybrid solutions to demonstrate the potential of a more holistic approach to silicon integrated systems.\",\"PeriodicalId\":244331,\"journal\":{\"name\":\"2015 IEEE 12th International Conference on Group IV Photonics (GFP)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-10-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 12th International Conference on Group IV Photonics (GFP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GROUP4.2015.7305902\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 12th International Conference on Group IV Photonics (GFP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GROUP4.2015.7305902","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

硅光子学提供大带宽和低损耗延迟,而集成电子学可以提供增益和复杂的信号处理,开销更低。在这里,我们将讨论这种混合解决方案的几个例子,以展示更全面的硅集成系统方法的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid silicon photonics and electronics solutions for communications, sensing, and imaging
Silicon photonics offer large bandwidths and low-loss delay, while integrated electronics can provide gain and complex signal processing with much lower overhead. Here, we will discuss a few examples of such hybrid solutions to demonstrate the potential of a more holistic approach to silicon integrated systems.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信