K. Takano, K. Katayama, S. Hara, R. Dong, K. Mizuno, Kazuaki Takahashi, A. Kasamatsu, T. Yoshida, S. Amakawa, M. Fujishima
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300-GHz CMOS transmitter module with built-in waveguide transition on a multilayered glass epoxy PCB
A 300-GHz CMOS transmitter module with a WR-3.4 waveguide interface is presented. The CMOS transmitter is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB) and a transmission-line-to-waveguide transition with a back-short structure is built of the multilayered PCB. The measured output power and 3-dB bandwidth of the transmitter module are approximately −13.5 dBm and 10 GHz, respectively. A wireless data rate of 48 Gbit/s over 5 cm with 16-QAM is achieved using the module.
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