三阈值电压9晶体管SRAM单元,在超低电源电压下实现数据稳定性和能效

Hong Zhu, V. Kursun
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引用次数: 4

摘要

电源电压缩放是微处理器中常用的一种节能技术。电源电压的可扩展性受到SRAM单元在内存缓存中的数据稳定性和写入能力要求的限制。存储单元的噪声边界会缩小,从而降低可靠性,并在较低的电源电压下导致故障。本文提出了一种能够在低至390mV的超低电源电压下可靠工作的三阈值电压九晶体管SRAM单元。在提供相当或更高的数据稳定性的同时,与台积电65nm CMOS技术中工作在标称VDD = 1.2V的传统6T SRAM阵列相比,tri-Vt 9T SRAM阵列的泄漏功耗、每读周期能量和每写周期能量分别降低了94.5%、22.8%和34.5%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Triple-threshold-voltage 9-transistor SRAM cell for data stability and energy-efficiency at ultra-low power supply voltages
Supply voltage scaling is a commonly used technique for saving energy in microprocessors. The scalability of power supply voltage is limited by the data stability and write ability requirements of SRAM cells in memory cache. Noise margins of memory cells shrink, thereby degrading reliability and causing failure at lower power supply voltages. A triple-threshold-voltage nine-transistor SRAM cell that is capable of reliable operation at ultra-low power supply voltage levels down to 390mV is presented in this paper. While offering comparable or higher data stability, the tri-Vt 9T SRAM array lowers the leakage power consumption, energy per read cycle, and energy per write cycle by up to 94.5%, 22.8%, and 34.5%, respectively, as compared to the conventional 6T SRAM arrays that operate at the nominal VDD = 1.2V in a TSMC 65nm CMOS technology.
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