{"title":"DSP实现低计算量的三维声音定位算法","authors":"N. Sakamoto, W. Kobayashi, T. Onoye, I. Shirakawa","doi":"10.1109/SIPS.2001.957336","DOIUrl":null,"url":null,"abstract":"This paper describes a DSP implementation of a real-time 3D sound localization algorithm. A distinctive feature of this implementation is that the audible frequency band is divided into three on the basis of the analysis of the effects of sound diffraction, such that in these three subbands specific schemes of the 3D sound localization are devised with the use of an IIR filter, three parametric equalizers, and a comb filter, respectively, so as to be run real-time on a 16-bit fixed-point DSP at a low frequency of 50 MHz, maintaining the high-quality sound localization. As a result, this 3D sound localization scheme can be applied to mobile applications such as headphones and a handy-phone with the use of an embedded DSP.","PeriodicalId":246898,"journal":{"name":"2001 IEEE Workshop on Signal Processing Systems. SiPS 2001. Design and Implementation (Cat. No.01TH8578)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"DSP implementation of low computational 3D sound localization algorithm\",\"authors\":\"N. Sakamoto, W. Kobayashi, T. Onoye, I. Shirakawa\",\"doi\":\"10.1109/SIPS.2001.957336\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes a DSP implementation of a real-time 3D sound localization algorithm. A distinctive feature of this implementation is that the audible frequency band is divided into three on the basis of the analysis of the effects of sound diffraction, such that in these three subbands specific schemes of the 3D sound localization are devised with the use of an IIR filter, three parametric equalizers, and a comb filter, respectively, so as to be run real-time on a 16-bit fixed-point DSP at a low frequency of 50 MHz, maintaining the high-quality sound localization. As a result, this 3D sound localization scheme can be applied to mobile applications such as headphones and a handy-phone with the use of an embedded DSP.\",\"PeriodicalId\":246898,\"journal\":{\"name\":\"2001 IEEE Workshop on Signal Processing Systems. SiPS 2001. Design and Implementation (Cat. No.01TH8578)\",\"volume\":\"80 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE Workshop on Signal Processing Systems. SiPS 2001. Design and Implementation (Cat. No.01TH8578)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIPS.2001.957336\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE Workshop on Signal Processing Systems. SiPS 2001. Design and Implementation (Cat. No.01TH8578)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIPS.2001.957336","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
DSP implementation of low computational 3D sound localization algorithm
This paper describes a DSP implementation of a real-time 3D sound localization algorithm. A distinctive feature of this implementation is that the audible frequency band is divided into three on the basis of the analysis of the effects of sound diffraction, such that in these three subbands specific schemes of the 3D sound localization are devised with the use of an IIR filter, three parametric equalizers, and a comb filter, respectively, so as to be run real-time on a 16-bit fixed-point DSP at a low frequency of 50 MHz, maintaining the high-quality sound localization. As a result, this 3D sound localization scheme can be applied to mobile applications such as headphones and a handy-phone with the use of an embedded DSP.