无源、多级ReRAM阵列读出电路的实际考虑

J. Xing, Hui Xu, Jiwei Li, Wei Wang, Haijun Liu, Qingjiang Li
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引用次数: 2

摘要

ReRAM正逐渐成为后摩尔闪存的潜在替代品,但其隐藏路径问题可能会阻碍其在多级存储中的应用。针对多电平读出应用,提出了两种合适的隐路缓偏方案(pd -读方案和tia -读方案),重点分析了ADC误读对多电平读出性能的影响。对ADC误读引起的读出性能下降进行了详细的理论推导。建立了一个经过验证的硬件系统。实验结果表明,两种读出方案均能精确测量IΩ ~ 1MΩ范围内的线性电阻的电阻。与PD-read方案相比,TIA -read方案对ADC误读的容忍度更高,因此更适合作为多级读出方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Practical considerations of read-out circuits for passive, multi-level ReRAM arrays
ReRAM is emerging as a potential replacement candidate for post-Moore flash memory, while the sneak-path problem may hinder the possible applications in multi-level storages. The paper presents two proper sneak-path mitigation bias schemes (PD-read scheme and TIA-read scheme) for the multi-level read-out applications, and focus on the understanding of the effect of ADC misread that limits the multi-level read-out performance. The detail theoretical deduction of the read-out performance degradation induced by the ADC misread is present. A verified hardware system is built. The experimental results show that both the read-out schemes can measure precisely the resistance of linear resistors ranging from IΩ to 1MΩ. TIA — read scheme is more tolerant for the ADC misread than PD-read scheme, thus be more suitable as the multi-level read-out scheme.
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