{"title":"通用应用负载板(L/B)和插座与直流测试仪(DCT)的各种封装","authors":"Yi-Sheng Lin, Yu-Hsiang Hsiao, Pei-Yu Tseng, Yu-Jen Chang, Cheng-Hsin Liu, Yu-Ting Lin","doi":"10.31399/asm.cp.istfa2021p0330","DOIUrl":null,"url":null,"abstract":"\n We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.","PeriodicalId":188323,"journal":{"name":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages\",\"authors\":\"Yi-Sheng Lin, Yu-Hsiang Hsiao, Pei-Yu Tseng, Yu-Jen Chang, Cheng-Hsin Liu, Yu-Ting Lin\",\"doi\":\"10.31399/asm.cp.istfa2021p0330\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.\",\"PeriodicalId\":188323,\"journal\":{\"name\":\"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.31399/asm.cp.istfa2021p0330\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.istfa2021p0330","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
我们利用O/S测试仪(Direct Current tester, DCT)开发了一种新的工作流程,可以快速检测故障封装的缺陷位置,可用于半导体行业的E-FA (Electrical failure Analysis,电气故障分析)故障定位,包括短路、漏电和开路缺陷。本文介绍了DCT的功能,并给出了两个识别焊球缺陷位置的案例研究,其中具有缺陷映射功能的DCT作为一种无损分析技术是有用的。本文介绍了一种新的DCT方法及其在不同尺寸封装中开放性缺陷和短缺陷检测中的应用。设计测试程序和内部工具的实验结果验证了缺陷映射功能在确定缺陷引脚位置方面的准确性。
Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages
We develop a new workflow with O/S tester (Direct Current Tester, DCT) to detect quickly the defect location of failure packages, which can be used in the semiconductor industry for E-FA (Electrical Failure Analysis) fault localization for short, leakage, and open defects. This paper introduces the capability and presents two case studies identifying the defect location of solder balls where DCT with defect mapping function is useful as a non-destructive analysis technique. In this paper, the new methodology and application of DCT on open and short defects in various packages with different sizes have been presented. The experimental results of the design testing program and an intender tooling were verified for the accuracy of the defect mapping function in determining the pin location to defect.