热堆在中红外波导上的集成

2019 International Conference on Optical MEMS and Nanophotonics (OMN) Pub Date : 2019-07-01 DOI:10.1109/OMN.2019.8925263

Mahmut Sami Yazici, D. Hasan, B. Dong, Fujun Sun, Chengkuo Lee

{"title":"热堆在中红外波导上的集成","authors":"Mahmut Sami Yazici, D. Hasan, B. Dong, Fujun Sun, Chengkuo Lee","doi":"10.1109/OMN.2019.8925263","DOIUrl":null,"url":null,"abstract":"We report integration of infrared (IR) thermopile sensor with Mid-IR waveguides via flip-chip bonding technology. A photonic device with input and output grating couplers designed at 3.72um are fabricated on silicon-on-insulator (SOI) platform and integrated with a bare thermopile chip on its output side to realize integrated photonic platform for a myriad range of sensing applications.","PeriodicalId":353010,"journal":{"name":"2019 International Conference on Optical MEMS and Nanophotonics (OMN)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Integration of Thermopile on a Mid IR Waveguide\",\"authors\":\"Mahmut Sami Yazici, D. Hasan, B. Dong, Fujun Sun, Chengkuo Lee\",\"doi\":\"10.1109/OMN.2019.8925263\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report integration of infrared (IR) thermopile sensor with Mid-IR waveguides via flip-chip bonding technology. A photonic device with input and output grating couplers designed at 3.72um are fabricated on silicon-on-insulator (SOI) platform and integrated with a bare thermopile chip on its output side to realize integrated photonic platform for a myriad range of sensing applications.\",\"PeriodicalId\":353010,\"journal\":{\"name\":\"2019 International Conference on Optical MEMS and Nanophotonics (OMN)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Optical MEMS and Nanophotonics (OMN)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMN.2019.8925263\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Optical MEMS and Nanophotonics (OMN)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMN.2019.8925263","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

我们报道了红外热电堆传感器与中红外波导通过倒装键合技术的集成。在SOI (silicon-on-insulator，硅绝缘体)平台上制作了一种输入输出光栅耦合器尺寸为3.72um的光子器件，并在其输出端集成了一个裸热电堆芯片，实现了集成光子平台，可用于多种传感应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Integration of Thermopile on a Mid IR Waveguide

We report integration of infrared (IR) thermopile sensor with Mid-IR waveguides via flip-chip bonding technology. A photonic device with input and output grating couplers designed at 3.72um are fabricated on silicon-on-insulator (SOI) platform and integrated with a bare thermopile chip on its output side to realize integrated photonic platform for a myriad range of sensing applications.

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2019 International Conference on Optical MEMS and Nanophotonics (OMN)

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