用于高速电路和系统设计的超宽带集成技术

2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON) Pub Date : 2010-04-12 DOI:10.1109/WAMICON.2010.5461856

Rhonda R. Franklin, Hosaeng Kim, Y. Cho

{"title":"用于高速电路和系统设计的超宽带集成技术","authors":"Rhonda R. Franklin, Hosaeng Kim, Y. Cho","doi":"10.1109/WAMICON.2010.5461856","DOIUrl":null,"url":null,"abstract":"This paper will describe methods developed to enhance the effective integration of complex systems. A variety of integration techniques will be described for coplanar waveguide based architectures used for in-plane and three-dimensional wafer scale packaging. Each approach offers low loss and low dispersion characteristics from DC to V-band and in special cases W-band.","PeriodicalId":112402,"journal":{"name":"2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Ultra-broadband integration techniques for high-speed circuits and systems design\",\"authors\":\"Rhonda R. Franklin, Hosaeng Kim, Y. Cho\",\"doi\":\"10.1109/WAMICON.2010.5461856\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will describe methods developed to enhance the effective integration of complex systems. A variety of integration techniques will be described for coplanar waveguide based architectures used for in-plane and three-dimensional wafer scale packaging. Each approach offers low loss and low dispersion characteristics from DC to V-band and in special cases W-band.\",\"PeriodicalId\":112402,\"journal\":{\"name\":\"2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON)\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WAMICON.2010.5461856\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WAMICON.2010.5461856","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

本文将描述为增强复杂系统的有效集成而开发的方法。各种集成技术将描述用于平面内和三维晶圆级封装的基于共面波导的架构。每种方法都具有从直流到v波段以及在特殊情况下w波段的低损耗和低色散特性。

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Ultra-broadband integration techniques for high-speed circuits and systems design

This paper will describe methods developed to enhance the effective integration of complex systems. A variety of integration techniques will be described for coplanar waveguide based architectures used for in-plane and three-dimensional wafer scale packaging. Each approach offers low loss and low dispersion characteristics from DC to V-band and in special cases W-band.

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来源期刊

2010 IEEE 11th Annual Wireless and Microwave Technology Conference (WAMICON)

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