{"title":"使用TLM方法建模三维不连续的一般方法","authors":"C. Boussetta, F. Ndagijimana, J. Chilo, P. Saguet","doi":"10.1109/EUMA.1994.337433","DOIUrl":null,"url":null,"abstract":"In this paper, we present a methodology for analysing interconnections in high speed logic devices using a full wave 3D technique. The 3D TLM method is used to compute in time domain the electromagnetic field in the structure. S-parameters of discontinuities are calculated from reflected and transmitted electromagnetic fields. An equivalent network of the discontinuity is extracted from the calculated S-parameters. This methodology is general and can be applied to any planar or 3D discontinuity, over a wide range of frequency. To illustrate its performance, results are presented for a microstrip right angle bend and a via up to 60 GHz.","PeriodicalId":440371,"journal":{"name":"1994 24th European Microwave Conference","volume":"74 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A general methodology of modelling 3D discontinuities using the TLM method\",\"authors\":\"C. Boussetta, F. Ndagijimana, J. Chilo, P. Saguet\",\"doi\":\"10.1109/EUMA.1994.337433\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we present a methodology for analysing interconnections in high speed logic devices using a full wave 3D technique. The 3D TLM method is used to compute in time domain the electromagnetic field in the structure. S-parameters of discontinuities are calculated from reflected and transmitted electromagnetic fields. An equivalent network of the discontinuity is extracted from the calculated S-parameters. This methodology is general and can be applied to any planar or 3D discontinuity, over a wide range of frequency. To illustrate its performance, results are presented for a microstrip right angle bend and a via up to 60 GHz.\",\"PeriodicalId\":440371,\"journal\":{\"name\":\"1994 24th European Microwave Conference\",\"volume\":\"74 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 24th European Microwave Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUMA.1994.337433\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 24th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1994.337433","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A general methodology of modelling 3D discontinuities using the TLM method
In this paper, we present a methodology for analysing interconnections in high speed logic devices using a full wave 3D technique. The 3D TLM method is used to compute in time domain the electromagnetic field in the structure. S-parameters of discontinuities are calculated from reflected and transmitted electromagnetic fields. An equivalent network of the discontinuity is extracted from the calculated S-parameters. This methodology is general and can be applied to any planar or 3D discontinuity, over a wide range of frequency. To illustrate its performance, results are presented for a microstrip right angle bend and a via up to 60 GHz.
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