台湾GaAs集成电路制造对亚太无线市场的挑战

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) Pub Date : 2001-10-21 DOI:10.1109/GAAS.2001.964336

L.W. Yang, P. Chao, L. Wu

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引用次数: 1

摘要

作者考虑了亚太地区的市场前景，描述了基于硅集成电路制造记录的商业模式，并强调了技术挑战。

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The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market

The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.

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来源期刊

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)

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