F. Bagaglini, L. Simone, T. Tupputi, M. Belardinelli, M. Bertinelli, D. Gelfusa, D. Giancristofaro, E. Rondoni, R. Roscigno, N. Salerno, M. Salvati
{"title":"带转发器和高数据速率有效载荷数据发射机的x波段集成单元","authors":"F. Bagaglini, L. Simone, T. Tupputi, M. Belardinelli, M. Bertinelli, D. Gelfusa, D. Giancristofaro, E. Rondoni, R. Roscigno, N. Salerno, M. Salvati","doi":"10.1109/TTC.2019.8895468","DOIUrl":null,"url":null,"abstract":"The main technical objectives of the ESA financed activity (ITT 9111 - ESA Contract No. 4000123441/18/NL/FE) currently underway at Thales Alenia Space Italia is the design, development of a breadboard of an integrated Payload Data Transmitter (PDT) and Telemetry, Tracking and Command (TT&C) equipment and its validation. The paper will describe major achievements, key technologies and specific issues of the future integrated communication unit (ICU): in a single very compact equipment both the transponder and high data rate payload data transmitter functionalities are integrated. The ICU under development in TAS-in-Italy is based on new design concepts as long as disruptive technologies aiming to face the emerging so called “NewSpace” market. Leveraging on the many years of experiences on transponder line (well consolidated Digital Signal Processing (DSP) building blocks are used) and developing new and very attractive architecture approach (direct synthesis as opposed to traditional conversion approaches) the paper will show how a very lightweight equipment with reduced components can be conceived. The equipment architecture description will be provided by highlighting key concepts and main components. A section is here devoted to EEE parts quality policy. As far as technology is concerned, the RF-on-PCB will be introduced as a key cornerstone to achieve driver requirements as required by constellation market, e.g., low cost, short lead time and high production rate.","PeriodicalId":330874,"journal":{"name":"2019 8th International Workshop on Tracking, Telemetry and Command Systems for Space Applications (TTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"X-band Integrated Unit with Transponder and High Data Rate Payload Data Transmitter\",\"authors\":\"F. Bagaglini, L. Simone, T. Tupputi, M. Belardinelli, M. Bertinelli, D. Gelfusa, D. Giancristofaro, E. Rondoni, R. Roscigno, N. Salerno, M. 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Leveraging on the many years of experiences on transponder line (well consolidated Digital Signal Processing (DSP) building blocks are used) and developing new and very attractive architecture approach (direct synthesis as opposed to traditional conversion approaches) the paper will show how a very lightweight equipment with reduced components can be conceived. The equipment architecture description will be provided by highlighting key concepts and main components. A section is here devoted to EEE parts quality policy. 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X-band Integrated Unit with Transponder and High Data Rate Payload Data Transmitter
The main technical objectives of the ESA financed activity (ITT 9111 - ESA Contract No. 4000123441/18/NL/FE) currently underway at Thales Alenia Space Italia is the design, development of a breadboard of an integrated Payload Data Transmitter (PDT) and Telemetry, Tracking and Command (TT&C) equipment and its validation. The paper will describe major achievements, key technologies and specific issues of the future integrated communication unit (ICU): in a single very compact equipment both the transponder and high data rate payload data transmitter functionalities are integrated. The ICU under development in TAS-in-Italy is based on new design concepts as long as disruptive technologies aiming to face the emerging so called “NewSpace” market. Leveraging on the many years of experiences on transponder line (well consolidated Digital Signal Processing (DSP) building blocks are used) and developing new and very attractive architecture approach (direct synthesis as opposed to traditional conversion approaches) the paper will show how a very lightweight equipment with reduced components can be conceived. The equipment architecture description will be provided by highlighting key concepts and main components. A section is here devoted to EEE parts quality policy. As far as technology is concerned, the RF-on-PCB will be introduced as a key cornerstone to achieve driver requirements as required by constellation market, e.g., low cost, short lead time and high production rate.