带转发器和高数据速率有效载荷数据发射机的x波段集成单元

F. Bagaglini, L. Simone, T. Tupputi, M. Belardinelli, M. Bertinelli, D. Gelfusa, D. Giancristofaro, E. Rondoni, R. Roscigno, N. Salerno, M. Salvati
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引用次数: 0

摘要

ESA资助的活动(ITT 9111 - ESA合同号4000123441/18/NL/FE)目前正在泰利斯阿莱尼亚宇航公司进行,主要技术目标是设计、开发集成有效载荷数据发射机(PDT)和遥测、跟踪和指挥(TT&C)设备的breadboard,并对其进行验证。本文将描述未来集成通信单元(ICU)的主要成就、关键技术和具体问题:在一个非常紧凑的设备中,将转发器和高数据速率有效载荷数据发送功能集成在一起。意大利塔斯大学正在开发的ICU是基于新的设计理念,以及旨在面对新兴的所谓“新空间”市场的颠覆性技术。利用多年来在转发器线路上的经验(使用了整合良好的数字信号处理(DSP)构建模块)和开发新的非常有吸引力的架构方法(直接合成而不是传统的转换方法),本文将展示如何构想出具有较少组件的非常轻的设备。设备架构描述将通过强调关键概念和主要组件来提供。这里有一节专门介绍电子电气设备零件的质量政策。就技术而言,RF-on-PCB将作为实现星座市场要求的驱动程序要求的关键基石,例如低成本,短交货时间和高生产率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
X-band Integrated Unit with Transponder and High Data Rate Payload Data Transmitter
The main technical objectives of the ESA financed activity (ITT 9111 - ESA Contract No. 4000123441/18/NL/FE) currently underway at Thales Alenia Space Italia is the design, development of a breadboard of an integrated Payload Data Transmitter (PDT) and Telemetry, Tracking and Command (TT&C) equipment and its validation. The paper will describe major achievements, key technologies and specific issues of the future integrated communication unit (ICU): in a single very compact equipment both the transponder and high data rate payload data transmitter functionalities are integrated. The ICU under development in TAS-in-Italy is based on new design concepts as long as disruptive technologies aiming to face the emerging so called “NewSpace” market. Leveraging on the many years of experiences on transponder line (well consolidated Digital Signal Processing (DSP) building blocks are used) and developing new and very attractive architecture approach (direct synthesis as opposed to traditional conversion approaches) the paper will show how a very lightweight equipment with reduced components can be conceived. The equipment architecture description will be provided by highlighting key concepts and main components. A section is here devoted to EEE parts quality policy. As far as technology is concerned, the RF-on-PCB will be introduced as a key cornerstone to achieve driver requirements as required by constellation market, e.g., low cost, short lead time and high production rate.
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