用表面轮廓仪测量硅化镍薄膜的杨氏模量

M. Qin, C. Y. Yuen, M. Poon, W. Y. Chan
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引用次数: 1

摘要

在晶体硅上形成的NiSi薄膜的杨氏模量是通过测量薄膜的挠度作为其中心载荷的函数来确定的。为了减小未知泊松比和结构边界所带来的误差,采用杨氏模量为370 Gpa的Si/sub 3/N/sub 4/薄膜作为参考。结果表明,在350/spl℃下形成的NiSi的杨氏模量为132 GPa,低于正常生长的多晶硅(/spl sim/160 GPa)和Si/sub 3/N/sub 4/。这意味着NiSi是一种很有前途的MEMS结构材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurement of Young's modulus of nickel silicide film by a surface profiler
Young's modulus of NiSi film formed on crystal silicon is determined by measuring the deflection of the film as a function of the loaded force on the center of it. In order to reduce the error caused by unknown Poisson's ratio and the boundary of the structure, Si/sub 3/N/sub 4/ film with a Young's modulus of 370 Gpa is used as a reference. The results show that NiSi formed at 350/spl deg/C has a Young's modulus of 132 GPa, which is lower than that that of normal grown polysilicon (/spl sim/160 Gpa) and Si/sub 3/N/sub 4/. It means that the NiSi is a promising structure material for MEMS application.
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