微电子器件封装材料环氧成型化合物

{"title":"微电子器件封装材料环氧成型化合物","authors":"N. Kinjo, M. Ogata, K. Nishi, A. Kaneda, K. Dušek","doi":"10.1007/BFB0017963","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":102004,"journal":{"name":"Speciality Polymers / Polymer Physics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"164","resultStr":"{\"title\":\"Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices\",\"authors\":\"N. Kinjo, M. Ogata, K. Nishi, A. Kaneda, K. Dušek\",\"doi\":\"10.1007/BFB0017963\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":102004,\"journal\":{\"name\":\"Speciality Polymers / Polymer Physics\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-12-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"164\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Speciality Polymers / Polymer Physics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1007/BFB0017963\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Speciality Polymers / Polymer Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/BFB0017963","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}