光电子用a-SiC:H薄膜的激光处理

D. Ghica, N. Mincu, C. Stanciu, G. Dinescu, E. Aldea, V. Sandu, A. Andrei, M. Dinescu, A. Ferrari, M. Balucani, G. Lamedica
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引用次数: 0

摘要

非晶和氢化(a-SiC:H)以及晶体碳化硅是光电应用的广泛材料。本文研究了激光/射频等离子体射流处理等离子体增强化学气相沉积法沉积的a-SiC:H薄膜对硅晶片的影响。使用Nd:YAG激光(λ = 1.06微米,tFWHM = 14 ns, E0 = 0.015 J/脉冲),入射量为4 mJ/cm2,脉冲数不同。等离子体处理是在容量耦合射频放电产生的等离子体射流中进行的。采用x射线衍射、x射线光电子能谱和透射电镜等不同的分析技术对辐照前后的薄膜进行了研究。我们跟踪了激光/等离子体处理对其结构和组成的影响。与准分子和射频处理进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Laser treatment of a-SiC:H thin films for optoelectronic applications
Amorphous and hydrogenated (a-SiC:H) as well as crystalline silicon carbide are widespread materials for optoelectronic applications. In this paper, we studied the effect of laser/RF plasma jet treatment of a-SiC:H thin films deposited by Plasma Enhanced Chemical Vapor Deposition, on Si wafers. A Nd:YAG laser ((lambda) equals 1.06 micrometers , tFWHM equals 14 ns, E0 equals 0.015 J/pulse) was used with a fluence of 4 mJ/cm2 incident on the sample, the number of pulses being varied. Plasma treatments were performed in a plasma jet generated by a capacity coupled RF discharge in N2. Different analysis techniques were used to investigate the films, before and after the irradiation: X-ray diffraction, X-ray photoelectron spectroscopy and transmission electron microscopy. We followed the modification of their structure and composition as an effect of the laser/plasma treatment. A comparison with the excimer and also with the RF treatments was performed.
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