Wanli Li, Qingqing Sun, Xuying Liu, K. Suganuma, T. Minari
{"title":"用于印刷电子产品的空气稳定铜复合油墨,具有高导电性和高可靠性","authors":"Wanli Li, Qingqing Sun, Xuying Liu, K. Suganuma, T. Minari","doi":"10.23919/ICEP.2019.8733423","DOIUrl":null,"url":null,"abstract":"In this work, two kinds of photonic sintering methods: laser sintering and intense pulsed light sintering are used to sinter air-stable Cu complex inks and achieve dense microstructures of Cu patterns. It is found that the microstructure of sintered Cu patterns from Cu complex inks is highly depended on the removal process of organic matter during the decomposition process. It is difficult to achieve dense and uniform microstructure of Cu pattern by using photonic sintering because of the rapid evaporation of organic matter. The introduction of the low-temperature pre-curing process before photonic sintering can drive the decomposition of Cu complex in a mild way and realize a uniform structure of Cu patterns. The subsequent intense pulsed light can further drive the sintering of Cu patterns to form a highly dense and uniform microstructure of Cu patterns and achieve high conductivity and reliability.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Air-stable Cu complex inks for printed electronics with high conductivity and high reliability\",\"authors\":\"Wanli Li, Qingqing Sun, Xuying Liu, K. Suganuma, T. Minari\",\"doi\":\"10.23919/ICEP.2019.8733423\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, two kinds of photonic sintering methods: laser sintering and intense pulsed light sintering are used to sinter air-stable Cu complex inks and achieve dense microstructures of Cu patterns. It is found that the microstructure of sintered Cu patterns from Cu complex inks is highly depended on the removal process of organic matter during the decomposition process. It is difficult to achieve dense and uniform microstructure of Cu pattern by using photonic sintering because of the rapid evaporation of organic matter. The introduction of the low-temperature pre-curing process before photonic sintering can drive the decomposition of Cu complex in a mild way and realize a uniform structure of Cu patterns. The subsequent intense pulsed light can further drive the sintering of Cu patterns to form a highly dense and uniform microstructure of Cu patterns and achieve high conductivity and reliability.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733423\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733423","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Air-stable Cu complex inks for printed electronics with high conductivity and high reliability
In this work, two kinds of photonic sintering methods: laser sintering and intense pulsed light sintering are used to sinter air-stable Cu complex inks and achieve dense microstructures of Cu patterns. It is found that the microstructure of sintered Cu patterns from Cu complex inks is highly depended on the removal process of organic matter during the decomposition process. It is difficult to achieve dense and uniform microstructure of Cu pattern by using photonic sintering because of the rapid evaporation of organic matter. The introduction of the low-temperature pre-curing process before photonic sintering can drive the decomposition of Cu complex in a mild way and realize a uniform structure of Cu patterns. The subsequent intense pulsed light can further drive the sintering of Cu patterns to form a highly dense and uniform microstructure of Cu patterns and achieve high conductivity and reliability.