基于能量的BGA焊点疲劳寿命模型

2017 Second International Conference on Reliability Systems Engineering (ICRSE) Pub Date : 2017-07-01 DOI:10.1109/ICRSE.2017.8030795

Jiamin Liu, Weiwei Hu, Hao Chen, Jiuxing Wang

{"title":"基于能量的BGA焊点疲劳寿命模型","authors":"Jiamin Liu, Weiwei Hu, Hao Chen, Jiuxing Wang","doi":"10.1109/ICRSE.2017.8030795","DOIUrl":null,"url":null,"abstract":"In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.","PeriodicalId":317626,"journal":{"name":"2017 Second International Conference on Reliability Systems Engineering (ICRSE)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A fatigue life model of BGA solder joints based on energy\",\"authors\":\"Jiamin Liu, Weiwei Hu, Hao Chen, Jiuxing Wang\",\"doi\":\"10.1109/ICRSE.2017.8030795\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.\",\"PeriodicalId\":317626,\"journal\":{\"name\":\"2017 Second International Conference on Reliability Systems Engineering (ICRSE)\",\"volume\":\"57 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Second International Conference on Reliability Systems Engineering (ICRSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICRSE.2017.8030795\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Second International Conference on Reliability Systems Engineering (ICRSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICRSE.2017.8030795","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文以BGA焊点为研究对象。在合理的假设条件下，建立了基于能量守恒定律的疲劳寿命预测模型。基于能量的寿命预测模型避免了对疲劳过程中各种复杂损伤机理的分析，只使用能量作为衡量指标。利用ANSYS有限元分析软件对温度循环条件下BGA焊点的力学响应进行了研究，得到了BGA焊点的应力应变特性。结合加速试验，推导了基于能量的BGA焊点寿命预测模型参数。根据数据曲线拟合图，验证了基于能量的BGA焊点疲劳寿命预测模型的合理性。

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A fatigue life model of BGA solder joints based on energy

In this paper, the BGA solder joint is considered as the object of study. A fatigue life prediction model based on energy conservation law is constructed by reasonable assumptions. Energy-based life prediction model can avoid the analysis of various complex damage mechanisms in fatigue process, and only use energy as a measure. The mechanical response of BGA solder joint under temperature cycling condition is studied by ANSYS finite element analysis software and the stress and strain characteristics of BGA solder joints are obtained. Combining with accelerated test, parameters of BGA solder joint life prediction model based on energy are deduced. According to the figure of data curve fitting, the rationality of the energy-based fatigue life prediction model of BGA solder joints is verified.

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来源期刊

2017 Second International Conference on Reliability Systems Engineering (ICRSE)

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