环氧树脂微米复合材料的耐跟踪性能研究

Linghui Yang, Yingping Chen, Jisheng Huang, Ya Wang, Xuesheng Dong, Dongxian Tan
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引用次数: 0

摘要

为了研究微米级二氧化硅对环氧绝缘材料表面电阻的影响,提高环氧树脂微米级复合材料的电阻,制备了掺杂不同微米级二氧化硅颗粒的三种环氧树脂复合材料。采用ASTM D2132-62T测试方法,通过记录电标记失效时间来评估环氧微米复合材料的电阻。通过静态接触角测试研究了样品的疏水性,并对样品的电学和力学性能进行了测试。结果表明:随着微米级二氧化硅颗粒掺杂含量的增加,样品的耐电标记性和疏水性变得更好,样品的介电常数先减小后增大,介电损耗恒定,体积电阻先减小后增大,但介电强度先增大后减小,不同样品的电性能差异较小。抗折强度和抗拉强度均略有增加,冲击强度先减小后增大。对试样的电学和力学性能进行综合测试,提高试样的抗弯强度和抗拉强度,适当降低介电常数和体积电阻率,提高介电强度,可使环氧微米复合材料的电阻性能更好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on resistance to tracking of epoxy resin micron composites
In order to study the effect of micron silica on the surface resistance of epoxy insulating materials and improve the resistance of epoxy resin micron composites, three kinds of epoxy resin composites doped with different micron silica particles were prepared. By using the ASTM D2132-62T test method, the resistance of epoxy micron composites was evaluated by recording the time of electrical mark failure. The hydrophobicity of the sample was studied by static contact angle measurement, and the electrical and mechanical properties of the sample were tested. The results show that with the increase of the doping content of micron silica particles, the resistance to electrical marks and hydrophobicity of the samples become better, The dielectric constant of the sample decreases first and then increases, the dielectric loss is constant, the volume resistance decreases first and then increases, but the dielectric strength increases first and then decreases, and the difference of electrical properties of different samples is small. both the bending strength and the tensile strength are slightly increased, and the impact strength decreases first and then increases. the comprehensive test of the electrical and mechanical properties of the specimen increases the bending strength and tensile strength of the specimen, appropriately reduces the dielectric constant and volume resistivity, and increases the dielectric strength, which can make the resistance of epoxy micron composites better.
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