降低峰值温度的三维芯片多处理器实时约束任务调度

Jiayin Li, Meikang Qiu, J. Niu, Tianzhou Chen, Yongxin Zhu
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引用次数: 11

摘要

芯片多处理器技术由于其巨大的计算需求而在嵌入式系统中得到了应用。三维芯片多处理器结构是集成更多功能和提供更高性能的研究热点。芯片上的高温是3D架构的一个关键问题。本文提出了一种三维芯片热在线预测模型。利用该模型,提出了一种基于旋转调度的任务调度算法,以降低芯片上的峰值温度。考虑了当前大多数热感知任务调度算法没有很好地考虑的数据依赖关系,特别是迭代间的依赖关系。仿真结果表明,该算法可以有效地将峰值温度降低到10C以下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature
Chip multiprocessor technique has been implemented in embedded systems due to the tremendous computation requirements. Three dimension chip multiprocessor architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this paper, we propose an online thermal prediction model for 3D chip. Using this model, we present a task scheduling algorithm based on rotation scheduling to reduce the peak temperature on chip. We consider the data dependencies, especially the inter-iteration dependencies which are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation result shows that our algorithm can efficiently reduce the peak temperature up to 10C.
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